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晶圆贴膜机 Wafer Mounter

产(chǎn) 品 说 明 晶圆贴膜机 （Wafer Mounter）性能(néng)及特点：切割制程用(yòng) For dicing processes 迅速的将晶圆贴在有(yǒu)胶膜的框架上，适合所有(yǒu)的切割框架，有(yǒu)效的切割及减少对框架伤害的特殊设计For rapid mounting of dicing frames, wafers and film. Suitable for all types ofdicing frames ,specially-desig…