产(chǎn) 品 说 明
晶圆贴膜机 (Wafer Mounter)性能(néng)及特点:
切割制程用(yòng) For dicing processes
迅速的将晶圆贴在有(yǒu)胶膜的框架上,适合所有(yǒu)的切割框架,有(yǒu)效的切割及减少对框架伤害的特殊设计
For rapid mounting of dicing frames, wafers and film. Suitable for all types of
dicing frames ,specially-designed cutters cut the film efficiently with minimal
damage to dicing frames
规格 Specification
型号 AV-WM106 AV-WM108 AV-WM112
晶圆尺寸(最大) 150mm 200mm 300mm
胶膜宽度(最大) 230mm 300mm 400mm
尺寸LxDxH(mm) 850x410x325 850x410x325 950x510x325
重 量 45KG 55KG 60KG
标准配置 镀PFA真空工(gōng)作(zuò)盘,加热工(gōng)作(zuò)盘
选用(yòng)配置 非接触工(gōng)作(zuò)盘、ESD装(zhuāng)置、胶膜隔离层回卷装(zhuāng)置